Universal & Production Device Programmers, Adapters | Elnec
show-menu
0 položiek | košík Elnec online objednávky

Obvod: W25Q64JVxxxM (ISP)

Výrobca: Winbond

Popis čísla dielu pre toto zariadenie:

Nabehnutím kurzora zvýraznite konkrétnu sekciu
W Winbond  
XXX Family Descriptor 25P = spiFlash serial flash memory
25Q = spiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
25X, 25D = spiFlash serial flash memory with 4kB sectors, dual outputs
25B = spiFlash serial flash memory with boot and parameter sectors
XXX Density 10, 10A, 10B, 10C, 10R = 1Mbit
20, 20A, 20B, 20C, 20R, 21E = 2Mbit
40, 40A, 40B, 40C, 40R = 4Mbit
80, 80A, 80B, 80D, 81D = 8Mbit
16, 16A, 16B, 16C, 16D, 16J = 16Mbit
32, 32A, 32B, 32D, 32F = 32Mbit
64, 64B, 64C, 64D, 64F = 64Mbit
128B, 128F, 12P = 128Mbit
256F, 257F = 256Mbit
512J = 512Mbit
01J = 1Gbit
02J = 2Gbit
X Supply Voltage L = 2.3V to 3.3V
V = 2.7V to 3.6V
W = 1.65V to 1.95V
XX Package Type DA = PDIP8 300mil
SN = SOIC8 150mil
SS = SOIC8 200mil
SF = SOIC16 300mil
ZP = WSON8 6x5mm
ZE = WSON8 8x6mm
UU = USON8 4x3mm
UX = 8-pad USON 2x3mm
B = TFBGA24 8x6mm (5x5 ball array) (W25Q128FV)
C = TFBGA24 8x6mm (6x4 ball array) (W25Q128/256FV)
E = WSON8 8x6mm (W25Q128/256FV)
F = SOIC16 300mil (W25Q128/256FV)
P = WSON8 6x5mm (W25Q128FV)
S = SOIC8 200mil (W25Q128FV)
SV = VSOP8 150mil
ST, T = VSOP8 208mil
TB = 24-ball TFBGA 8x6mm (5x5-1 ball array)
TC = 24-ball TFBGA 8x6mm (6x4 ball array)
BY = 8-ball WLCSP
XH = 8-pad XSON 2x3
X Temperature Range C = Commercial (0°C to 70°C)
I = Industrial (-40°C to 85°C)
A = Automotive Grade 2 (-40°C to +105°C)
J = Industrial Plus (-40°C to +105°C)
S
X Special Options Blank = Standard
G = Green package (Lead-free, RoHS compliant, Halogen-free (TBBA),
Antimony-Oxide-free Sb203)
Z = Lead free (Lead-free, RoHS compliant)
1 = One time program (OTP) enabled
P = Green Package with Status Register Power-Down & OTP enabled
Q = Green Package with QE=1 in Status Register-2
M = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA),
Antimony-Oxide-free SB2O3) & optimized for mobile applications
N = Green Package with QE=1 in Status register-2 & DRV=75\\\\%
E = Green Package with Extended Pad
F = Green Package with QE=0 in Status Register-2 & SFDP
XXX Transfer Rate Blank = Single transfer rate
DTR = Double transfer rate

Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.

vrátiť späť na zoznam výsledkov

Podporovaný programátormi a programovacími adaptérmi/modulmi:

BeeHive204 adaptér/modul: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC
BeeHive204AP adaptér/modul: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC
BeeHive208S adaptér/modul: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC
BeeProg2 adaptér/modul: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC
BeeProg2AP adaptér/modul: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC
BeeProg2C adaptér/modul: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC
BeeHive204AP-AU (prestala byť podporovaná) adaptér/modul: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC
SmartProg2 (prestala byť podporovaná) adaptér/modul: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC
vrátiť späť na zoznam výsledkov
🍪
Naspäť HORE